66H080000-051
CU-BASED PASSIVE HEATSINK
廠商型號:
66H080000-051
芯天下內(nèi)部編號:
2609-66H080000-051
生產(chǎn)廠商:
chenbro micom usa, inc.
描述:
CU-BASED PASSIVE HEATSINK
產(chǎn)品類別:
Boxes, Enclosures, and Racks
客戶編號:
所示圖像僅為示意圖,。請從產(chǎn)品數(shù)據(jù)表中獲得準確的規(guī)格,。
庫存與訂購
產(chǎn)品參數(shù)
| 參數(shù)類型 | 參數(shù)值 |
|---|
相似產(chǎn)品
| 型號 | 廠商 | 描述 | 操作 |
|---|---|---|---|
| 66H080000-032 | chenbro micom usa, inc. | CHENBRO HEAT SINK | 查看詳情 |
| 66H080000-042 | chenbro micom usa, inc. | NON ROHS PGA 775 HEATSINK | 查看詳情 |
| 66H080000-043 | chenbro micom usa, inc. | COOLJAG JAC16EC HS, LGA775 | 查看詳情 |
| 66H080000-046 | chenbro micom usa, inc. | HEAT SINK, SIDE FLOW FOR PENTIUM 4 UP TO 3.6GHZ (ALUMINUM) | 查看詳情 |